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产品特点
■适合于微加工
■整机风冷却方式
■新型半导体激光源，电光转换效率高，使用寿命长
■倍频转换的效率，较窄的激光脉冲宽度
■整机能耗低，免维护，可靠性高
Product features
● suitable for micromachining
●Air cooling
●New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime
●Hgh efficiency frequency doubling conversion, narrow laser pulse width
●Low power consuming, maintenance free, stable performance
技术参数Technical parameter
输出功率 Laser power 6W/12W
激光波长 Wavelength 532nm
光束质量 Beam quality ㎡＜1.3
标刻范围 Marking scope 65×65/110×110/160×160mm(可选 optional)
标刻速度 Marking speed ≤7000mm/s
小线宽 line width 0.01mm
小字符 haracter 0.1mm
脉 宽 Pulse width 20ns(20KHz)
脉冲能量 Pulse energy 150μj(20KHz)
脉冲重复频率 Repeat precision 10-200KHz
供电电源 Power supply 220V±10% 50Hz/12A
整机功耗 Power Consumption 400W
工作温度 Working temperature 5℃--35℃
适用材料Applicable Materials
大多数金属和非金属的表面加工和镀层薄膜的加工；玻璃和水晶制品的表面雕刻。
Surface processing and coating film processing of most metal and non-metal materials. Surface engraving of glass and crystal products.
适用领域Applicable field
光学器件，手机屏，LCD屏，汽车玻璃，PCB板，陶瓷，硅片，塑料等行业
Optical device, mobile phone screen, LCD screen, car glass, PCB board, ceramic, silicon, plastic and so on
打印效果
